Cold Box
Processes involve sand and a reactive resin
to make the sand core. This resin reacts
chemically when exposed to an accelerator,
typically an active organic gas, and hardens
very quickly, forming an organic bond in the
core sand. The majority of this sand/resin
mix is removed during shakeout but not
completely.
Description :
Foundry Immersion Metal Cleaners
Our Foundry Immersion Cleaners have been
formulated to break this organic bond in
order to remove any residual resin from
vents and hard to reach cavities.
Our
Foundry Immersion Cleaners come in two
varieties, solvent based and water based.
Our water based products are strong alkaline
solutions that readily break down the sand
resin. These are typically used when VOC
monitoring is an issue, but should only be
used on ferrous metals. Our solvent based
products offer a more worker friendly
solution. They are not nearly as caustic as
our water based products and are safe to use
on non ferrous metals such as aluminum.
These products find excellent utility in dip
tank applications but can also be used in
other applications such as spray.
FoundryGeneral® Foundry Cleaner 2988 is a unique water extended NMP formulation that has been designed to aggressively break down urethane resins and release agents from the screens, vents and surface of core boxes.
FoundryGeneral® Foundry Cleaner 4950 is a unique water extended NMP formulation that has been designed to aggressively break down urethane resins and release agents from the screens, vents and surface of core boxes. It contains less VOC than FoundryGeneral® Foundry Cleaner 2988.
FoundryGeneral® Foundry Cleaner 5095 WB is an aqueous, caustic formulation that has been designed to aggressively break down urethane resins and release agents from the screens, vents and surfaces of core boxes.
FoundryGeneral® Neutralizing Solution CA-5 is used in conjunction with FoundryGeneral® Foundry Cleaner 5095 WB. It is used as a post rinse to FoundryGeneral® Foundry Cleaner 5095 WB to neutralize any residual caustic solution that may persist on the substrate being cleaned.
